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Two Component, Low Viscosity Compound

Product News Thursday, August 15, 2013: Master Bond Inc

Master Bond EP21LVSP6 is a two component epoxy compound for high performance bonding, coating, sealing and encapsulating. It is formulated to cure at room temperature or more rapidly at elevated temperatures. It offers a very convenient one to one mix ratio, by weight or volume. EP21LVSP6 is particularly well conceived for specialty applications where the combination of a long open time, low viscosity and excellent properties are all vital to an application. The system also has very good chemical resistance to water, oil, fuel, acids and bases. EP21LVSP6 bonds well to a variety of substrates, including metals, composites, glass, ceramics, rubbers and plastics. It has very good physical strength properties as well as being a good electrical insulator. It has a service temperature range of -60°F to +250°F. The color of Part A is clear and Part B is amber clear. This system can be used in aerospace, electronic, electrical, optical and other specialty applications where high performance properties combined with a long pot life and low viscosity are desirable. As one would expect with this kind of system, it has very low exotherm and can be used for large castings.

Product Advantages

• Convenient mixing: non-critical equal weight or volume ratio.
• Low viscosity for ease of application.
• Exceptionally long open time.
• High bonding strength to a wide variety of substrates.
• Magnificent electrical insulation properties.
• Little exotherm; suitable for large castings.